SiC Power Modules
Utilizing self-developed high-performance SiC chips, we achieve higher efficiency, higher power density, and superior high-temperature stability through continuous innovation in design, materials, and processes. This provides extremely reliable and miniaturized solutions for electric drive and energy systems.
Optimized Structural Design
SiC technology platform with a highly compact architecture,
effectively reducing packaging costs.
Enhanced Core Processes
Self-developed thick copper substrate technology,
combined with module integration design,
achieves optimal thermal resistance characteristics.
Superior Thermal Materials
Self-developed high thermal conductivity insulated substrates,
balancing cost, performance, and operational reliability.
Reliable Safety Performance
Complies with RoHS environmental standards,
passing AQG 324 automotive-grade reliability certification.
Easy Installation
No special processes required,
simple installation and use.
Wide Compatibility
Compatible with 400V and 800V systems,
freely matching various device types.
Contact
Shanghai Headquarters: Building 23 No.588, Xinjunhuan Rd, Minhang District, Shanghai, China
Manufacturing Center: No. 29 Qingliang Avenue, Jiaxing City, Zhejiang Province, China
Integrity Reporting: zinsight-sunshine@zinsight-tech.com