SiC Power Modules

DPAK

A transfer-molded power module utilizing high-reliability epoxy molding compound and a ceramic insulated substrate. The module features a high-current lead frame design and low thermal resistance packaging, making it suitable for high-current, high-power applications. Its compact structure, ease of installation, and flexible topology enable versatile use in various power electronic converter applications.

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DPAK
  • DPAK

Technical Highlights

  1. 1

    Compact Structure
    Footprint reduced by 50% compared to TO-247 discrete packages.

  2. 1

    Easy Application
    Built-in insulation for simplified installation.

  3. 1

    Strong Adaptability
    Compatible with multiple circuit topologies
    and supports parallel power scaling.

  4. 1

    High Reliability
    Maximum junction temperature (Tj max) of 175°C,
    certified to AQG324 standard.

Technical Specifications

Rated Voltage 1200V
Rated Current 90A - 260A
Rds(on) 10mΩ, 5 mΩ
Circuit Topology Half-Bridge / Single Switch
Substrate Material DBC / AMB
Cooling Air Cooling / Water Cooling
Operating Junction Temperature -40°C to 175°C
Storage Temperature -40°C to 175°C
Safety Standard RoHS
Reliability Certification AQG324

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